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Comparison ledger

-407B-2-S-CE-S293 RobotversusMxP+ Poly

ABM -407B-2-S-CE-S293 Robot, Applied Materials MxP+ Poly, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MxP+ PolyApplied Materials
OEMABMApplied Materials
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
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FamilyABM -407B-2-S-CE-S293 RobotApplied Materials MxP+ Poly
Cited variants—
  • Applied Materials P5000 MxP+ Poly[1]
Specifications
ModelABM-407B-2-S-CE-S293[2]—
DescriptionROBOT[2]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2]—
Wafer Size—200mm[3]
Platform—Centura 5200[3]
Process Type—Polysilicon Etch[3]
Date of Manufacture—1998[3]
Software Version—4.9_15[3]
Orienter Quantity—1[3]
MxP Poly Quantity—1[3]
MxP+ Poly Quantity—2[3]
eMxP+ ESC Quantity—1[3]
End Point Detection—Monochromator[3]
Gases Used—NF3, CH3F, CL2, HBR, CHF3, AR, CF4, O2, N2, C4F8, CO, HE/O2[3]
MFCs—32 Digital MFC's[3]
Robot—HP Robot[3]
Dry Pumps—4-IQDP80, 2-IQDP80/WSU151[3]
Chillers—5-Neslab-150[3]
Wafer Size (Asseta)—6"[1]
ESC Type—Polymide[3]
Sources (3)Every fact above is drawn from these public sources
  1. [1]asseta.comasseta.com
  2. [2]dealer listingsemistarcorp.com
  3. [3]macquarie.commacquarie.com