Comparison ledger
ABM -407B-2-S-CE-S293 Robot, Panasonic NPM W 2 Chip Mounter, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | NPM W 2 Chip MounterPanasonic | |
|---|---|---|
| OEM | ABM | Panasonic |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ABM -407B-2-S-CE-S293 Robot | Panasonic NPM W 2 Chip Mounter |
| Cited variants | — | |
| Specifications | ||
| Model | ABM-407B-2-S-CE-S293[2] | — |
| Description | ROBOT[2] | — |
| Refurbished RTP RTA | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[2] | — |
| KLA-Tencor Spare Parts and Service | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[2] | — |
| Refurbished Isotropic Plasma Etcher | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[2] | — |
| Refurbished PECVD, ALD Equipment | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[2] | — |
| Refurbished Mask Aligner | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[2] | — |
| Refurbished Bonding | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[2] | — |
| Refurbished Wafer Prober | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[2] | — |
| PCB dimensions (single conveyor, batch) | — | L 50 mm × W 50 mm to L 750 mm × W 550 mm[1] |
| PCB dimensions (dual conveyor, dual transfer batch) | — | L 50 mm × W 50 mm to L 750 mm × W 260 mm[3] |
| Placement head max speed (per head, lightweight 16-nozzle head V3A) | — | 42,000 cph (0.086 s/chip)[1] |
| Placement speed (dual head, high production mode) | — | 84,000 cph (IPC9850: 61,200 cph)[1] |
| Placement accuracy (high production mode) | — | ±40 μm/chip (Cpk ≥ 1)[3] |
| Placement accuracy (high accuracy mode) | — | ±30 μm/chip (Cpk ≥ 1)[3] |
| Placement accuracy (optional) | — | ±25 μm/chip (under specified conditions)[4] |
| Component dimensions | — | 03015 chip to L 120 mm × W 90 mm × T 30 mm / T 40 mm or L 150 mm × W 25 mm × T 30 mm / T 40 mm[1] |
| Number of placement heads | — | 2[3] |
| Feeder capacity (max, tape 4/8 mm) | — | 120 feeders[3] |
| Machine dimensions (standard config, W x D x H) | — | 1,280 mm × 2,465 mm × 1,444 mm[1] |
| Machine mass (standard config) | — | 2,850 kg[1] |
| Power supply | — | 3-phase AC 200 to 480 V, 2.8 kVA[1] |
| Air supply pressure | — | 0.5 MPa[1] |
| Air consumption | — | 200 L/min (A.N.R.)[1] |
| Supported heads (partial list from catalog) | — | Lightweight 16-nozzle head V3A, 12-nozzle head, Lightweight 8-nozzle head, 3-nozzle head V2, Dispensing head, Inspection head (2D)[1] |