Waferpedia

Comparison ledger

AD 3000 T Dicingversus15

Accretech AD 3000 T Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMAccretechLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech AD 3000 T DicingLapmaster 15
Specifications
Machine typeFully automatic dicing machine[1]—
Wafer sizeΦ305 mm[1]—
Maximum work sizeΦ305 mm[1]—
Maximum supported frame12 inch (SEMI G74-0699)[1]—
Spindle rating1.8 kW[1]—
Spindle maximum rotation speed60,000 rpm[1]—
X axis fastest speed1,000 mm/sec[1]—
Y axis fastest speed300 mm/sec[1]—
Z axis fastest speed80 mm/sec[1]—
Voltage3 Phase AC200 to 220 V ±10%[1]—
Power consumption6.0 kVA (MAX)[1]—
Air supply pressure0.55 to 0.7 MPa[1]—
Dimensions (W x D x H)1,290 mm x 1,530 mm x 1,900 mm[1]—
Weight1,360 kg[1]—
Asset number71678[2]—
Vintage2015[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]accretech.comaccretech.com
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org