Comparison ledger
Accretech HRG 200 X, Disco 3220, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | HRG 200 XAccretech | 3220Disco |
|---|---|---|
| OEM | Accretech | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech HRG 200 | Disco 3220 |
| Specifications | ||
| Grinding Wheel Diameter | 250 mm[1] | — |
| Grinding Wheel Spindle Speed | Max. 3600 rmp[1] | — |
| Working Spindle Speed | 800 rpm[1] | — |
| Motor Power | 6.3 KW[1] | — |
| Wafer Sizes | 2, 3, 4, 5, 6, 8 inch[1] | — |
| Wafer Size Range | 2-inch to 8-inch wafers[2] | — |
| Machine Type | Fully Automatic High Rigid 2-Axis Grinder[3] | — |
| equipment type | — | dicing saw[4] |
| Workplace size | — | ø150 mm[5] |
| Spindle layout | — | Single[5] |
| Spindle output | — | 1.5 kW at 30,000 min-1[5] |
| Spindle max revolution speed | — | 40,000 min-1[5] |
| X-axis feed speed range | — | 0.1 – 500 mm/s[5] |
| Y-axis index step | — | 0.0001 mm[5] |
| Z-axis repeating accuracy | — | 0.001 mm[5] |
| Z-axis max blade size | — | ø58 mm[5] |
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