Comparison ledger
Applied Materials 0010-03254 E Chuck, EV Group 310, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03254 E ChuckApplied Materials | 310EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | unified GUI program platform called EVG CIMFramework |
| Generation | — | — |
| Family | — | EV Group 310 |
| Specifications | ||
| Tool name | — | EVG 310[1] |
| Type | — | single wafer cleaner[1] |
| Cleaning function | — | megasonic DI water cleaner[1] |
| Modules | — | cleaning module (CLM) and pre-bond station and infrared lamp imaging module (IRM)[1] |
| Cleaning use | — | used to clean wafers[1] |
| Pre-bond use | — | used to put wafers in contact (prebond)[1] |
| Imaging use | — | used to image through the wafer stack with infrared illumination to look for bonding defects (voids)[1] |