Comparison ledger
Applied Materials 0010-03485 Magnet Assy, Bruker Dektak 150 High Performance Surface Profiler, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Bruker |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | Bruker Dektak 150 High Performance Surface Profiler |
| Cited variants | — |
|
| Specifications | ||
| Configuration | WP AL 300mm PVD[2] | — |
| OEM | Applied Materials[2] | — |
| Model | 0010-03485[2] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[3] | — |
| Process | PVD[4] | — |
| Wafer size | 300mm[5] | — |
| Version | Spares[5] | — |
| Part Number | 0010-03485[2] | — |
| Manufacturer | Applied Materials[2] | — |
| Process Type | PVD (Physical Vapor Deposition)[2] | — |
| Application (Material) | Aluminum (AL)[2] | — |
| Wafer Diameter (associated) | 300 mm[2] | — |
| Measurement Technique | — | Contact stylus profilometry[1] |
| Scan Length Range | — | 55 mm standard; up to 200 mm with stitching option[1] |
| Data Points Per Scan | — | 120,000 maximum[1] |
| Max. Sample Thickness | — | Up to 90 mm[1] |
| Max. Wafer Size | — | 150 mm (200 mm with Advanced Automation Package)[1] |
| Step Height Repeatability | — | ≤6 Å (D150); ≤4 Å (D150+ option); 1 sigma on 0.1 μm step[1] |
| Vertical Range | — | 524 μm (1 mm optional)[1] |
| Vertical Resolution | — | 1 Å max. (at 6.55 μm range)[1] |
| Stylus Force | — | 1 to 15 mg with LIS 3 sensor; 0.03 to 15 mg with N-Lite sensor option[1] |
| Stylus Options | — | Radius options from 50 nm to 25 μm; HAR tips 10 μm x 2 μm and 200 μm x 20 μm[1] |
| Sample Stage | — | Manual X/Y/θ, 100 x 100 mm X-Y translation, 360° rotation, manual leveling; optional X-Y auto stage 150 mm travel, 1 μm repeatability; optional 200 mm wafer vacuum chuck; optional 6-inch square porous vacuum chuck[1] |
| Computer System | — | PC with Pentium D or Athlon processor[1] |
| Software | — | Dektak software running under Windows XP; Step Detection software (std.); optional Stress Measurement software; optional 3D Mapping with Vision analysis software; optional Stitching software[1] |
| Environment Temperature Range | — | Between 20 and 25°C (68 to 77°F)[1] |
| Humidity Range | — | ≤50% ±20°C, non-condensing[1] |
| Dimensions | — | 292 mm W x 508 mm D x 527 mm H[1] |
| Weight | — | 34 kg (75 lbs)[1] |
| Certification | — | CE, NRTL, S2, S8*, China RoHS, EU RoHS[1] |