Comparison ledger
Applied Materials 0010-03485 Magnet Assy, EV Group 310, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | 310EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | unified GUI program platform called EVG CIMFramework |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | EV Group 310 |
| Specifications | ||
| Configuration | WP AL 300mm PVD[1] | — |
| OEM | Applied Materials[1] | — |
| Model | 0010-03485[1] | — |
| Description | MAGNET ASSY, WP AL 300MM PVD[2] | — |
| Process | PVD[3] | — |
| Wafer size | 300mm[4] | — |
| Version | Spares[4] | — |
| Part Number | 0010-03485[1] | — |
| Manufacturer | Applied Materials[1] | — |
| Process Type | PVD (Physical Vapor Deposition)[1] | — |
| Application (Material) | Aluminum (AL)[1] | — |
| Wafer Diameter (associated) | 300 mm[1] | — |
| Tool name | — | EVG 310[5] |
| Type | — | single wafer cleaner[5] |
| Cleaning function | — | megasonic DI water cleaner[5] |
| Modules | — | cleaning module (CLM) and pre-bond station and infrared lamp imaging module (IRM)[5] |
| Cleaning use | — | used to clean wafers[5] |
| Pre-bond use | — | used to put wafers in contact (prebond)[5] |
| Imaging use | — | used to image through the wafer stack with infrared illumination to look for bonding defects (voids)[5] |