Comparison ledger
Applied Materials 0010-03485 Magnet Assy, SUSS MicroTec Alignment, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | AlignmentSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | SUSS MicroTec Alignment |
| Cited variants | — | |
| Specifications | ||
| Configuration | WP AL 300mm PVD[2] | — |
| OEM | Applied Materials[2] | — |
| Model | 0010-03485[2] | Alignment[7] |
| Description | MAGNET ASSY, WP AL 300MM PVD[3] | — |
| Process | PVD[4] | — |
| Wafer size | 300mm[5] | — |
| Version | Spares[5] | — |
| Part Number | 0010-03485[2] | — |
| Manufacturer | Applied Materials[2] | SUSS MicroTec[6] |
| Process Type | PVD (Physical Vapor Deposition)[2] | — |
| Application (Material) | Aluminum (AL)[2] | — |
| Wafer Diameter (associated) | 300 mm[2] | — |
| Asset name | — | SUSS Alignment Tool[7] |
| Product family | — | Mask Alignment[1] |
| Substrate size | — | Up to 300 mm[1] |
| Alignment mode | — | Mask-to-wafer and wafer-to-wafer alignment[1] |
| Integrated metrology | — | Wafer prealignment and notch detection[1] |
| Topside alignment | — | Supported[8] |
| Backside alignment | — | Supported[8] |
| Substrate diameter range | — | 1" to 150 mm diameter[8] |
| Mask size range | — | 2.5" x 2.5" to 7" x 7"[8] |
| Maximum substrate thickness | — | 10 mm[8] |
| Resist compatibility | — | For use with i-line resists[8] |
| Tool type | — | Mask alignment[1] |
| Supported substrate size | — | up to 300 mm[1] |
| Alignment modes | — | mask-to-wafer and wafer-to-wafer alignment[1] |
| Alignment optics | — | precision optics[1] |
| Related system | — | MA/BA6 Mask Alignment System[8] |