Comparison ledger
Applied Materials 0010-03485 Magnet Assy, SVG 8800, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-03485 Magnet AssyApplied Materials | 8800SVG |
|---|---|---|
| OEM | Applied Materials | SVG |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-03485 Magnet Assy | SVG 8800 |
| Cited variants | — | |
| Specifications | ||
| Configuration | WP AL 300mm PVD[3] | Dual Coat with soft bake[1] |
| OEM | Applied Materials[3] | SVG[8] |
| Model | 0010-03485[3] | 8800[8] |
| Description | MAGNET ASSY, WP AL 300MM PVD[4] | — |
| Process | PVD[5] | — |
| Wafer size | 300mm[6] | 6 inch[8] |
| Version | Spares[6] | — |
| Part Number | 0010-03485[3] | — |
| Manufacturer | Applied Materials[3] | — |
| Process Type | PVD (Physical Vapor Deposition)[3] | — |
| Application (Material) | Aluminum (AL)[3] | — |
| Wafer Diameter (associated) | 300 mm[3] | — |
| Type | — | Single-track coater and developer[7] |
| Spindle acceleration | — | Up to 50,000 RPM/second[7] |
| Programmable dispense arm | — | Yes[7] |
| Automatic cassette wafer handling | — | Yes, dual load and unload[7] |
| Edge bead removal | — | Top nozzle[7] |
| Backside rinse | — | Bottom nozzle[7] |
| Hot plate temperature range | — | Up to 300 °C[7] |
| Developer dispense type | — | Pressurized nozzle[7] |
| Developer mode | — | Dynamic or static[7] |
| Developer rinse | — | DI water rinse[7] |
| Coater/Developer type | — | Photoresist coating and developing[7] |
| Spindle Motor Acceleration | — | 50,000 RPM/second[7] |
| Edge Bead Removal | — | Top nozzle for EBR[7] |
| Backside Rinse | — | Bottom nozzle for backside rinse[7] |
| Developer Type | — | Single track with pressurized dispense nozzle[7] |
| Cassette Handling | — | Automatic with dual load and unload[7] |
| Supported Wafer Size | — | 6 inch[8] |
| Equipment type | — | Coater / Developer[8] |
| Operating mode | — | Single track dispense photoresist spinner[7] |
| Cassette handling | — | Automatic cassette wafer handling with dual load and unload capability[7] |
| Dispense arm | — | Programmable dispense arm motion[7] |
| EBR | — | Top nozzle for Edge Bead Removal[7] |
| Hot plate oven | — | Programmable up to 300 C[7] |