Waferpedia

Comparison ledger

0010-13622 RF Match forversusProducer

Applied Materials 0010-13622 RF Match for, Applied Materials Producer, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
ProducerApplied Materials
OEMApplied MaterialsApplied Materials
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forApplied Materials Producer
Cited variants—
  • Producer Etcher eXT Poly[1]
  • Producer Etcher eXT Dielectric[2]
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[3]eXT Poly[1]
Model0010-13622[3]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[3]—
FeatureHigh Efficiency HE RF Match-Bias[3]—
Wafer size—8 inch[4]
Vintage—2000[4]
Process type—Plasma CVD[4]
Variant—eXT Poly[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing