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Comparison ledger

0010-13622 RF Match forversusConcept Two Triple Speed

Applied Materials 0010-13622 RF Match for, Lam Research Concept Two Triple Speed, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-13622 RF Match forApplied Materials
OEMApplied MaterialsLam Research
CategoryDepositionDeposition
Wafer size—Entegris FA 200-85 MT 7902 Wafer Cassette
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-13622 RF Match forLam Research Concept Two Triple Speed
Specifications
ConfigurationHigh Efficiency HE RF Match-Bias[1]DLCM[2]
Model0010-13622[1]—
Product TypeRF Match for PVD (Physical Vapor Deposition)[1]—
FeatureHigh Efficiency HE RF Match-Bias[1]—
Wafer Substrate—Silicon[2]
Software—Speed Next 5.502 B22[2]
Cable length—75 ft[2]
Wafer size—Entegris FA 200-85 MT 7902 Wafer Cassette[2]
Front End Option—SMIF Ready[2]
User Interface Options—Cleanroom (Right Side)[2]
Paddle & Arc Kits—STD[2]
Cool Station Options—MPS (Multi PEC Station)[2]
Particle Check Options—Particle Sensor Manifold[2]
Manometers—Heated[2]
Pressure Control—MKS[2]
Facilities Kit—Bottom[2]
Light Towers—3 Lights - RYG[2]
Light Towering Mounting—Staff Mount[2]
TM Cover Options—STD Cover[2]
MPD—Triple[2]
Wafer Size—8 inch[2]
Cable Length—75 ft DLCM[2]
Wafer Cassette—Entegris FA 200-85 MT 7902[2]
Active Wafer Centering—Yes[2]
Light Tower Mounting—Staff Mount[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing