Comparison ledger
Applied Materials 0010-13622 RF Match for, STS 310, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | 310STS |
|---|---|---|
| OEM | Applied Materials | STS |
| Category | Deposition | Deposition |
| Wafer size | — | 100mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | STS 310 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Tool type | — | plasma-enhanced chemical-vapor-deposition (PECVD) system[2] |
| Wafer size | — | 100-mm-diameter silicon wafers[2] |
| Deposition material | — | silicon dioxide[2] |
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