Comparison ledger
Applied Materials 0010-14300 Magnet Assy, Axcelis GSD 100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-14300 Magnet AssyApplied Materials | GSD 100Axcelis |
|---|---|---|
| OEM | Applied Materials | Axcelis |
| Category | Ion Implantation | Ion Implantation |
| Wafer size | — | No wafer top-side bar reading |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-14300 Magnet Assy | Axcelis GSD |
| Specifications | ||
| Configuration | P4 Magnet Assy, IMP[1] | Automated Beam tuning & setup w/Eaton Autotune[2] |
| Gearbox P/N | 0010-27417[1] | — |
| Part Number | 0010-14300[1] | — |
| Description | P4 Magnet Assy, IMP[1] | — |
| High Current | — | GSD 200 E[2] |
| Date of Audit | — | August 25, 2025[2] |
| Loading Configuration | — | Open Cassette[2] |
| Software Version | — | 6.12.4[2] |
| Beamline version | — | Standard[2] |
| Energy Range | — | 160 KeV[2] |
| Single Stage Extraction | — | 80 keV[2] |
| Post Accel electrode assembly | — | 80 -160 keV[2] |
| Ion Source Type | — | ELS[2] |
| Source Material | — | Moly[2] |
| Cryo compressors | — | CTI 9600[2] |
| Manufacturer | — | Axcelis[2] |
| Model | — | GSD 100[2] |
| Equipment Type | — | Implanter[3] |
| Wafer Size | — | 6 inch[2] |
| GEM / SECS Interface | — | Present[2] |
| Automated Beam Tuning | — | Automated Beam tuning & setup w/Eaton Autotune[2] |
| Compatibility | — | 4 cassette compatibility[2] |
| Automatic Alignment | — | Automatic flat or notch alignment capability with buffer cassette[2] |
| Process Disk | — | NV-GSD 200 Series Process Disk with active cooling & chiller[2] |
| Beamline Pump | — | CTI Onboard 10[2] |
| End Station Cryo Pump | — | CTI Onboard 8[2] |
| Source Turbo Pump | — | STP A 2203 C 2[2] |
| Gas Connections | — | Ar, N2[2] |
| Remote Disk Chiller | — | SMC HRS 050-WF-20[2] |
| External Facilities connections | — | Ar, N2[2] |
| Wafer size | — | No wafer top-side bar reading[2] |
| Source Turbo Pump (P1) | — | STP A 2203 C 2[2] |
| Beam Line Cryo Pump (P3) | — | CTI Onboard 10[2] |
| End Station Cryo Pump (P2) | — | CTI Onboard 8[2] |
| Ar | — | Tylan FC-2900 MEP, 5 SCCM[2] |
| Ar MFC | — | Tylan FC-2900 MEP, 5 SCCM[2] |
| BF3 Gas | — | Unit 1660 (SDS), 5 SCCM[2] |
| AsH3 Gas | — | Unit 1660 (SDS), 5 SCCM[2] |
| PH3 Gas | — | Unit 1660 (SDS), 5 SCCM[2] |
| Electrical Input | — | 3-phase, 208 V[3] |
| Power Consumption | — | 50 kVA[3] |
| Beam Current | — | 15 mA[3] |
| Output Rating | — | 160 kV[3] |
| Flag Faraday Injector | — | Present[2] |
| Signal Tower | — | Present[2] |
| Direct Drive | — | Yes[2] |
| Electron Shower | — | Yes[4] |
| Cell V6 Control | — | Yes[4] |
| Solaris | — | Yes[4] |
| SDS Gas Box | — | Yes[4] |
| Cassette Compatibility | — | 4 cassette compatibility[2] |
| Automatic Flat/Notch Alignment | — | Yes, with buffer cassette[2] |
| Standard Manuals Included | — | Yes[2] |
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