Comparison ledger
Applied Materials 0010-16392 ESC Assembly, Tegal 983, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-16392 ESC AssemblyApplied Materials | 983Tegal |
|---|---|---|
| OEM | Applied Materials | Tegal |
| Category | Etch | Etch |
| Wafer size | — | 125mm |
| Process node | — | down to 0.5 micron |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-16392 ESC Assembly | Tegal 983 |
| Specifications | ||
| OEM | Applied Materials[1] | — |
| Model | 0010-16392[1] | 983[3] |
| Type | ESC Assembly[1] | — |
| Wafer Size | 300 mm[2] | — |
| Electrode Configuration | Dual[2] | — |
| Product name | — | 983 ACS[3] |
| Category | — | Diode plasma etch tool[4] |
| Fixed electrode gap | — | 6 mm[4] |
| Round substrate size | — | 125 mm to 150 mm round silicon and GaAs substrates[4] |
| Rectangular substrate size | — | 125 mm to 150 mm on a side[4] |
| Best-suited design rules | — | down to 0.5 micron[4] |
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