Comparison ledger
Applied Materials 0010-18024 Pyrometer Assembly, Hitachi S 9220 CD-SEM, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-18024 Pyrometer AssemblyApplied Materials | S 9220 CD-SEMHitachi |
|---|---|---|
| OEM | Applied Materials | Hitachi |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | Wafer Transfer Robot: |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-18024 Pyrometer Assembly | Hitachi S 9220 |
| Specifications | ||
| Configuration | Capable of working on Applied Materials Radiance[1] | Single Phase[2] |
| Power Supply | — | 208 V, 60 Hz[2] |
| Wafer | — | Notch[3] |
| Length Measurement Method | — | Cursor & Line Profile Method[3] |
| Measuring Range | — | 0.1 μm ～ 2.0 μm[3] |
| Length Measurement Reproducibility | — | ± 1% or 3 nm (3σ) larger value[3] |
| Throughput | — | Continuous measurement mode 56 wafers / hr[3] |
| Length Measurement Reproduction Accuracy | — | 40k-150k-200k times[3] |
| Measuring Mode | — | Automatic & Manual[3] |
| Secondary Electron Image Resolution | — | 3 nm (acceleration voltage 0.8 kV)[3] |
| Optical Microscope Image | — | Approx 110 times[3] |
| SEM Image | — | 1k to 300k times[3] |
| Range of Movement | — | X-axis: 0-200 mm, Y-axis: 0-200 mm[3] |
| Drive System | — | Pulse Motor Drive[3] |
| Control | — | Computer control, positioning control by linear encoder[3] |
| Drive Speed | — | Max. 100 mm / sec (each X-axis & Y-axis)[3] |
| Wafer Carrier -> Loader Room | — | Automatic transfer by wafer transfer robot[3] |
| Wafer size | — | Wafer Transfer Robot:[3] |
| Length Measurement | — | Cursor & Line Profile Method[4] |
| Voltage | — | 100V[5] |
| Frequency | — | 60 Hz[6] |
| Image Magnification (Optical Microscope) | — | Approx. 110 times[3] |
| Image Magnification (SEM Image) | — | 1k to 300k times[3] |
| Stage Movement Range (X-axis) | — | 0-200 mm[3] |
| Stage Movement Range (Y-axis) | — | 0-200 mm[3] |
| Stage Drive Speed | — | Max. 100 mm / sec (each X-axis & Y-axis)[3] |
| Loader System | — | Automatic transfer by wafer transfer robot; random access type for 2 cassettes; vacuum suction chucking on back side; automatic OF/V-notch detection by optical sensor[3] |
| Acceleration Voltage | — | 500 to 1600 V (variable in 10 V steps)[3] |
| Lens System | — | Electromagnetic Lens System, Booster Stock Lens[3] |
| Detection System | — | Scintillator / photomultiplier detector using EXB filter; 2 stage detection method for SE and BSE images[3] |
| Scanning Coil | — | 2-stage electromagnetic deflection[3] |
| Astigmatism Correction | — | 8-pole electromagnetic system (X, Y)[3] |
| Probe Current Monitor | — | Built-in Faraday cup, with automatic measurement function[3] |
| Optical Microscope | — | Approximately 1.2 mm square field of view, with black and white CCD camera[3] |
| Control CRT | — | EWS (GUI) 21-inch CRT[3] |
| Scanning Mode | — | TV scan, with auto brightness / contrast function[3] |
| Image Processing | — | Software using filtering; real-time image processing (optional) using DSP[3] |
| Image Recording | — | Video printing device (optional) & image file save function (optional)[3] |
| Safety Device | — | With emergency shutoff switch (mushroom type)[3] |
| Data Storage Medium | — | 9G byte hard disk (including for system programs)[3] |
| Auxiliary Storage Medium | — | 3.5-inch magneto-optical disk driver, 3.5-inch F/D driver[3] |
| Data Embedding Function | — | Statistical calculation function using worksheets (mean value, standard deviation, etc.)[3] |
| Print Output | — | 80-digit thermal printer[3] |
| Vacuum Exhaust System | — | Fully automatic dry clean exhaust system; 3 ion pumps, two turbo molecular pumps, 2 dry pumps (supplied)[3] |
| Safety Functions | — | Protection function in the event of a power outage; AIR pressure drop; cooling water flow rate drop (self) with dynamic valve closing function; pump stop function[3] |
| Power Supply (208V variant) | — | 208 V, 60 Hz, Single Phase[2] |
| Power Supply (100V variant) | — | 100V, 60 Hz, Single Phase, 6kVA[5] |
| Power Supply (200V variant) | — | 200V, 60 Hz, Single Phase[6] |
| Method | — | Random access type for 2 cassettes[3] |
| Wafer Detection in Cassette | — | Wafer Searcher Built-in[3] |
| Chucking Method | — | Vacuum suction on the back side of the wafer[3] |
| OF, V-notch Detection | — | Automatic detection by optical sensor[3] |
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