Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, Panasonic NPM D 3 Electronic Production Modular, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Panasonic |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | — |
| Cited variants | — | |
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | — |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Machine type | — | Modular SMT placement machine / chip mounter[1] |
| OEM | — | Panasonic[4] |
| Model designation | — | NPM D 3 / NPM-D3[4] |
| Architecture | — | Compact, dual-beam head with reinforced frame[1] |
| PCB size (double-lane) | — | L50×W50 to L510×W300 mm[1] |
| PCB size (single-lane) | — | L50×W50 to L510×W590 mm[1] |
| Placement accuracy (H16 head) | — | ±0.04 mm (Cpk≥1); ±0.03 mm for 0402, 0603, 1005 placement[1] |
| Placement accuracy (H12/H08 heads) | — | ±0.03 mm for 0402, 0603, 1005 placement (Cpk≥1)[1] |
| Capacity (H16 head) | — | 84,000 CPH (chip: 0.043 s/chip); 76,000 CPH (chip: 0.047 s/chip)[1] |
| Capacity (H12 head) | — | 69,000 CPH (chip: 0.052 s/chip)[1] |
| Capacity (H08 head) | — | 43,000 CPH (chip: 0.084 s/chip)[1] |
| Capacity (H02 head) | — | 11,000 CPH (chip: 0.327 s/chip); 8,500 CPH (QFP: 0.423 s/chip)[1] |
| Placeable component size (H16 head) | — | 03015 to 6×6 mm; height max 3.0 mm[1] |
| Placeable component size (H12 head) | — | 0402 to 12×12 mm; height max 6.5 mm[1] |
| Placeable component size (H08 head) | — | 0402 to 32×32 mm; height max 12 mm[1] |
| Placeable component size (H02 head) | — | 0603 to 100×90 mm; height max 28 mm[1] |
| Machine size | — | W 832 × D 2,683 × H 1,444 mm (when connected to a tray feeder)[1] |
| Machine weight | — | Main body 1,680 kg; tray feeder 200 kg; exchange trolley 110 kg; check BOX 70 kg[1] |
| Multi-recognition camera | — | Field-scalable multi-recognition camera combining alignment, thickness and 3D coplanarity in one step[1] |
| Board handling | — | Flexible board handling system supporting single and multiple dual-lane operation modes[1] |
| Throughput improvement | — | IPC-9850 throughput boosted 30% to 38,078 CPH per square meter; placement accuracy improved by 25%[1] |
| Footprint and operation | — | Compact footprint and dual-side operation maximize factory floor space utilization and scalability[1] |