Comparison ledger
Applied Materials 0010-22161 High EFF RF Match, SUSS MicroTec ACS 200 Spin, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-22161 High EFF RF MatchApplied Materials | ACS 200 SpinSUSS MicroTec |
|---|---|---|
| OEM | Applied Materials | SUSS MicroTec |
| Category | — | — |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-22161 High EFF RF Match | SUSS MicroTec ACS 200 Spin |
| Cited variants | — |
|
| Specifications | ||
| Make | Applied Materials[2] | — |
| Model | 0010-22161[2] | — |
| Description | HTESC PH 1 REV A[3] | — |
| Condition | Used[3] | — |
| Stock Number | BM6628[3] | — |
| Maximum wafer diameter | — | 200 mm (8 in)[4] |
| Maximum substrate thickness | — | 5 mm[4] |
| Wafer diameters supported | — | 50 mm, 75 mm, 100 mm, 150 mm, 200 mm[4] |
| Photomask sizes supported | — | 125 mm x 125 mm, 150 mm x 150 mm[4] |
| Coating modules | — | Gyrset spin coat; Alta spray coat[4] |
| Hotplate maximum temperature | — | 250 °C[4] |
| Edge-bead removal | — | Automated with backside rinse[4] |
| Small pieces supported | — | Yes[4] |