Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Besi 2220 EVO, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | 2220 EVOBesi |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | Besi 2220 EVO |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Accuracy | — | ±10 µm @ 3 Sigma[2] |
| Die pick sources | — | wafers, waffle/gelpack, feeder[2] |
| Die placement targets | — | boat, substrate, PCB, wafer[2] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →