Comparison ledger
Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated, Hesse & Knipps LSB959, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-47763 ASSY ESC Bonded Monopolar Dual HeatedApplied Materials | LSB959Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-47763 ASSY ESC Bonded Monopolar Dual Heated | Hesse & Knipps LSB959 |
| Specifications | ||
| Configuration | Refurbished[1] | — |
| Type | — | Fully automatic heavy wire bonder with thermosonic function[2] |
| Machine type | — | Fully automatic heavy wire bonder with thermosonic function[3] |
| Process capability | — | Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[3] |
| Working area | — | 370 mm x 560 mm x 42 mm[3] |
| P-rotation | — | 440°[3] |
| Bondhead frequency | — | 60 kHz, alternative frequencies on request[3] |
| Wire size | — | Cu: 300 μm – 500 μm, other sizes on request[3] |
| Laser | — | IR fiber laser with power up to 130W[3] |
| Temperature output | — | Programmable temperature output[3] |
| Footprint | — | 805 mm x 1634 mm x 1912 mm[3] |
| Weight | — | Approx. 1300 kg[3] |
| Safety classification | — | Laser class 1[3] |
| Monitoring | — | Continuous real time monitoring of wire deformation, transducer current, frequency, and bond tool temperature within programmable control limits[3] |
| Quality control | — | Process integrated Quality Control (PiQC) is stated as an option[3] |
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