Comparison ledger
Applied Materials 0010 47763, Applied Materials Centura eMXP+, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Centura eMXP+Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Applied Materials Centura |
| Specifications | ||
| Configuration | 2nd Source New[1] | Oxide[4] |
| Type | Monopolar Dual Heated[2] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Model | 0010-47763[1] | — |
| OEM | Applied Materials[1] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[2] | — |
| Quantity available (source) | 1[2] | — |
| Software Version | — | E4.8_26[4] |
| Voltage | — | 208 VAC[4] |
| Full load current | — | 240A[4] |
| Frequency | — | 50/60 Hz[4] |
| Process | — | Nitride Spacer[4] |
| Wafer size | — | 8 inch[4] |
| Robot | — | HP+ Robot[4] |
| Excludes | — | LPT, Chiller, Dry Pump[4] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →