Waferpedia

Comparison ledger

0010 47763versus200 ACU

Applied Materials 0010 47763, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Axcelis NV GSD 200
Specifications
Configuration2nd Source New[1]Parts Machine[4]
TypeMonopolar Dual Heated[2]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[3]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
Model0010-47763[1]200 ACU[4]
OEMApplied Materials[1]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[2]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[2]—
Quantity available (source)1[2]—
Manufacturer—Axcelis[4]
Tool type—Asher[4]
Wafer size—200mm[6]
Serial number—AU6A356AH[6]
Computer system—M 200 PC, M 200[7]
Part number—SC 4572 A[7]
Volts—208[7]
Amps—30[7]
Equipment type—Asher[4]
Wafer configuration—8 inch[5]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]saulcontrol.comsaulcontrol.com
  3. [3]getspares.comgetspares.com
  4. [4]inventory listing
  5. [5]semistarcorp.comsemistarcorp.com
  6. [6]wotol.comwotol.com
  7. [7]semistarcorp.comsemistarcorp.com