Comparison ledger
Applied Materials 0010 47763, Lam Research Exelan Dry, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010 47763Applied Materials | Exelan DryLam Research |
|---|---|---|
| OEM | Applied Materials | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010 47763 | Lam Research Exelan Dry |
| Cited variants | — | |
| Specifications | ||
| Configuration | 2nd Source New[4] | — |
| Type | Monopolar Dual Heated[5] | — |
| Description | ASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[6] | — |
| Possible Materials | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[5] | — |
| Model | 0010-47763[4] | Exelan Dry[7] |
| OEM | Applied Materials[4] | — |
| Material (possible) | Al2O3 (aluminum oxide) or AlN (aluminum nitride)[5] | — |
| Application | Fixing wafers in etching process (PVD, CVD, ETCH)[5] | — |
| Quantity available (source) | 1[5] | — |
| Wafer Size | — | 300mm[1] |
| Vintage (manufacturing year) | — | 2005[1] |
| Wafer Size (via version) | — | 200mm[3] |
| Vintage | — | 2004-06-01[2] |
| Manufacturer | — | Lam Research[7] |
| Tool type | — | dry etch chamber[8] |
| Vintage year | — | 2005[8] |
| Variant designation | — | V2 Exelan[8] |
| Variant wafer size | — | 200mm[8] |
| Variant vintage year | — | 2004[8] |
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