Waferpedia

Comparison ledger

0010 47763versusTCP 9400 SE

Applied Materials 0010 47763, Lam Research TCP 9400 SE, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010 47763Applied Materials
TCP 9400 SELam Research
OEMApplied MaterialsLam Research
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010 47763Lam Research TCP 9400 SE
Cited variants—
  • 9400 SE (Model 9408)[1]
  • TCP 9400 SE (150 mm configuration)[2]
Specifications
Configuration2nd Source New[3]—
TypeMonopolar Dual Heated[4]—
DescriptionASSY, ESC, BONDED, MONOPOLAR DUAL HEATED[5]—
Possible MaterialsAl2O3 (aluminum oxide) or AlN (aluminum nitride)[4]—
Model0010-47763[3]—
OEMApplied Materials[3]—
Material (possible)Al2O3 (aluminum oxide) or AlN (aluminum nitride)[4]—
ApplicationFixing wafers in etching process (PVD, CVD, ETCH)[4]—
Quantity available (source)1[4]—
Software Revision—E1.6.1-002[6]
Main UI PN—PC NEXT 33[6]
ESC—718-094523-281[6]
Liner—715-030329-002[6]
GAZ Box Réf—853-024403-104[6]
Platform—Rainbow[7]
Source type—Inductively coupled (TCP)[7]
Wafer size—200 mm (8 inch)[6]
Chamber configuration—Single chamber[7]
Wafer transport—Cassette to cassette[7]
Vacuum pump—Leybold TURBOVAC 1000C[1]
Software version—Envision version 1.4[1]
End point detection—Emission and interferometric[7]
Ceramic free chamber—Yes[1]
Waferless auto clean (WAC)—Yes[1]
CE Certified—Yes[1]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]photonicmicrodevices.comphotonicmicrodevices.com
  2. [2]wotol.comwotol.com
  3. [3]inventory listing
  4. [4]saulcontrol.comsaulcontrol.com
  5. [5]getspares.comgetspares.com
  6. [6]inventory listing
  7. [7]photonicmicrodevices.comphotonicmicrodevices.com