Waferpedia

Comparison ledger

0020 18455 PartversusConcept Two Dual Sequel

Applied Materials 0020 18455 Part, Lam Research Concept Two Dual Sequel, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
OEMApplied MaterialsLam Research
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartLam Research Concept Two
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]RPC (2)[2]
Flat Type—Semi Notched[2]
Wafer Substrate—Silicon[2]
Software Version & Build—Sequel 4.94 B 38[2]
DLVM Mfg Type—Refurb - SSEMVIT[2]
PM 2 (Left)—Sequel[2]
PM 2 (Left) Mfg Type—Refurb - SSEMVIT[2]
PM 3 (Center)—Sequel[2]
PM 3 (Center) Mfg Type—Refurb - SSEMVIT[2]
PM 4 (Right)—Blank-Off[2]
Cable Length—75 ft[2]
Wafer Cassette—Entegris FA 200-8 MT 7902[2]
Front End Option—SMIF Ready[2]
User Interface Option—SMIF Ready[2]
User Interface Options—Cleanroom (Right Side)[2]
Paddle and Arc Kits—STD[2]
Cool Station Options—4 Shelf Cool Station[2]
Particle Check Options—Particle Sensor Manifold[2]
QTY—3 Systems (Single shrink chamber and dual standard chamber)[3]
Voltage—208 V[4]
Phase—3 Phase[4]
Category—Chemical Vapor Deposition (CVD)[2]
Wafer Size—8 inch[2]
Voltage / Frequency / Phase—208 V, 50/60 Hz, 3 Phase[4]
Full Load Current—10 A[4]
Max Component Current—5 Amp[4]
Software Version—Sequel 4.94 B 38[2]
Showerhead Material—AL 6061[2]
Pressure Control—MKS[2]
Manometers—Heated[2]
Facilities Kits—Bottom[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing