Waferpedia

Comparison ledger

0020 18455 PartversusBJD 2000

Applied Materials 0020 18455 Part, Temescal BJD 2000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 18455 PartApplied Materials
BJD 2000Temescal
OEMApplied MaterialsTemescal
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 18455 PartTemescal BJD 2000
Specifications
ConfigurationShaft,Rf In Local Match, Hdpcvd,Rev3[1]Batch loading vacuum chamber w/ 20" diameter hinged bell jar[2]
With—Two sets of removable shields for cleaning[2]
E-Beam Controller—Inficon Model XTC/3[2]
Process Controller—CTI Model CT-8 Onboard[2]
Power—6 KW EBeam Power Supply[2]

Plan your fab

Building a Deposition process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing