Comparison ledger
Applied Materials 0020 18455 Part, Ulvac SIV 500, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0020 18455 PartApplied Materials | SIV 500Ulvac |
|---|---|---|
| OEM | Applied Materials | Ulvac |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0020 18455 Part | Ulvac SIV 500 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Shaft,Rf In Local Match, Hdpcvd,Rev3[2] | — |
| Process module stations | — | 3 (P1, P2, P3)[1] |
| Pulsed DC power supply power | — | 5 kW[1] |
| Substrate size capability | — | up to 1000mm x 1000mm[3] |
| P3 sputtering power supply frequency | — | 13.56 MHz[1] |
| Cryo pump size | — | 12 inch[1] |
| Turbo/water pump size | — | 12 inch[1] |
| Voltage | — | 208 VAC +/- 5%, 3 phase, 60 Hz, 3 wire plus ground, 145.5 A[3] |
| Chamber dimensions | — | 500mm x 420mm[1] |
| Magnetron sources | — | 3[1] |
| DC planar sources | — | 1[1] |
| Substrate diameter max | — | 8 inches[1] |
| Carrier size | — | 500mm x 500mm[3] |
| Process modules | — | 3-station (P1, P2, P3)[1] |
| Power supply | — | 5 kW pulsed DC[1] |
| P3 dedicated to | — | ITO or other TCF with O₂ MFC and 13.56 MHz RF supply[1] |
| Chamber size (base machine) | — | 500 mm × 420 mm[1] |
| Maximum substrate size | — | 1000 mm × 1000 mm[3] |
| Pallet size (configured) | — | 500 mm × 500 mm[3] |
| Supported wafer sizes | — | 100 mm, 150 mm, 200 mm, 300 mm[3] |
| Pumping | — | Roughing pump, turbomolecular/water pump, Ulvac 12" cryo pump[1] |
| Sputter sources | — | Three magnetron sources and one DC planar source on XYZ stage[1] |
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