Waferpedia

Comparison ledger

0020 23839 PartversusUnity EP

Applied Materials 0020 23839 Part, Tokyo Electron Unity EP, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
Unity EPTokyo Electron
OEMApplied MaterialsTokyo Electron
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartTokyo Electron Unity
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]For Parts[2]
Wafer size—200mm[3]
Process type—Chemical Vapor Deposition (CVD)[2]
Chamber configuration—TiN chamber x3 (as listed)[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]grandbird.netgrandbird.net