Waferpedia

Comparison ledger

0020 54137 PartversusMomentum Elite

Applied Materials 0020 54137 Part, Speedline Momentum Elite, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 54137 PartApplied Materials
OEMApplied MaterialsSpeedline
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 54137 PartSpeedline Momentum
Cited variants—
  • Momentum Elite DL[1]
Specifications
ConfigurationConn Ector Copper Threaded W / Solder Ptg[2]50/60 Hz[3]
Largest Single Load—6 Amps[3]
Full Load Current—10 Amps[3]
Maximum Board Size (X x Y)—609.6 mm x 508 mm (24" x 20")[4]
Maximum Board Size (X x Y) in Staging Mode (Momentum Elite)—457 mm x 508 mm (18" x 20")[4]
Minimum Board Size (X x Y)—50.8 mm x 50.8 mm (2" x 2")[4]
Board Thickness—0.2 mm (0.008") to 5.0 mm (0.20"), up to 6.0 mm (0.24") without top clamp foils[4]
Maximum Print Area (X x Y)—609.6 mm x 508 mm (24" x 20")[4]
Print Gap (Snap-off)—0 mm to 6.35 mm (0" to 0.25")[4]
Stencil Frame Size—737 mm x 737 mm (29" x 29")[4]
Vision Field-of-View (FOV)—106 mm x 8 mm[4]
Total System Alignment—12.5 microns[4]
Alignment Repeatability—±0.0005" at 6 sigma, Cpk of greater than or equal to 2.0[4]
Power Requirements—200 to 240 VAC Single Phase 50/60Hz[4]
Air Supply—100 PSI at 4 CFM[4]
Dimensions (W x D x H)—1675.5 mm (65.96") x 1593.1 mm (62.72") x 1638.4 mm (64.5")[4]
Machine Weight—899 kg (1982 lbs)[4]
Wet Print Accuracy—20 microns @ 6 sigma, Cpk > 2[5]
Maximum Board Weight—4.5 kg (9.92 lbs)[5]
Board Edge Clearance—3.0 mm (0.118")[5]
Underside Clearance—12.7 mm (0.5") standard / Configurable for 25.4 mm (1.0")[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]youtube.comyoutube.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]ibesmt.comibesmt.com
  5. [5]semistarcorp.comsemistarcorp.com