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0041-26723 Bonded AssemblyversusAS 899

Applied Materials 0041-26723 Bonded Assembly, ASM AS 899, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0041-26723 Bonded AssemblyApplied Materials
AS 899ASM
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM AS 899
Cited variants—
  • AS 899 Die Bonder[1]
  • AS 899 Test & Sort[2]
Specifications
Category—Packaging & Bonding[3]
Frequency—50/60 Hz[2]
Voltage—230 Vac[2]
Phase—1 Phase[2]
Manufacture year—2014[2]
0041-26723 Bonded Assembly entryAS 899 entryAsk about these tools →Share experience with this comparison →

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com