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0041-26723 Bonded AssemblyversusIS 9012 LA Automatic CIS Flip Chip

Applied Materials 0041-26723 Bonded Assembly, ASM IS 9012 LA Automatic CIS Flip Chip, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
0041-26723 Bonded AssemblyApplied Materials
IS 9012 LA Automatic CIS Flip ChipASM
OEMApplied MaterialsASM
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyASM IS 9012 LA Automatic CIS Flip Chip
Specifications
Volts—220[1]
Hertz—50/60[1]
Make—ASM[2]
Model—IS 9012 LA[2]
Type—Automatic CIS Flip Chip Bonder[2]
Vintage—2010[2]
Voltage—220 V[1]
Frequency—50/60 Hz[1]
0041-26723 Bonded Assembly entryIS 9012 LA Automatic CIS Flip Chip entryAsk about these tools →Share experience with this comparison →

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing