Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, ASM Siplace CA 4 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | 8" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | ASM Siplace |
| Specifications | ||
| Configuration | — | High Volume Chip Assembly[1] |
| Wafer size | — | 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion[1] |
| Manufacturer | — | ASM[1] |
| Model | — | Siplace CA 4 Wafer[1] |
| Category | — | Packaging & Bonding[2] |
| Assembly type | — | High Volume Chip Assembly[1] |
| Wafer systems | — | 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion[1] |
| Wafer transfer systems | — | 4 Wafer Transfer Systems[1] |
| Camera and bonding head | — | 4 LP-Kamera (TYP34) and bonding Head C+P20[1] |
| Vacuum tooling | — | Single Transport Chuck[1] |
| Cooling system | — | Chiller Cooling System[1] |
| Vacuum pump | — | X-Series[1] |
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