Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 520, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 520EV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 520 |
| Specifications | ||
| Configuration | — | Refurbished[1] |
| Phase | — | 3 Phase[1] |
| Wafer size | — | Manual wafer load substrate bonder[1] |
| Wafer Size | — | up to 150 mm capable[1] |
| Vacuum Chuck | — | 6"/150mm diameter chuck[1] |
| Max Bond Force | — | 7 kN[1] |
| Top Side Heater | — | 550°C max. in 1°C steps[1] |
| Bottom Side Heater | — | 550°C max. in 1°C steps[1] |
| Temperature uniformity | — | ± 1,5 %[1] |
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