Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, EV Group 520 IS Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | 520 IS WaferEV Group |
|---|---|---|
| OEM | Applied Materials | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | EV Group 520 |
| Specifications | ||
| Configuration | — | Refurbished[1] |
| Wafer size | — | Manual wafer load substrate bonder[2] |
| Max Bond Force | — | 60 kN[2] |
| Top side heater | — | 550°C max. in 1°C steps[2] |
| Bottom side heater | — | 550°C max. in 1°C steps[2] |
| Temperature uniformity | — | ± 1,5 %[2] |
| OEM | — | EV Group[1] |
| Model | — | 520 IS Wafer[1] |
| Category | — | Packaging & Bonding[3] |
| Description | — | Manual wafer load substrate bonder[3] |
| Bonding capabilities | — | Capable of fusion compression bonding, thermal compression bonding, and optional anodic bonding[2] |
| Bond chamber | — | High-vacuum capable bond chamber[2] |
| Control software | — | Windows based control software and operation interface[2] |
| Top side heater max temperature | — | 550°C in 1°C steps[2] |
| Bottom side heater max temperature | — | 550°C in 1°C steps[2] |
| Included items | — | Chiller; turbo pump & controller; roughing pump; system computer, monitor, and keyboard[2] |
| Other stated features | — | Auto opening of bond tool cover; high-vacuum capable bond chamber; ideal for R&D and pilot production applications[2] |
| Vintage | — | 2008[2] |
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