Waferpedia

Comparison ledger

0041-26723 Bonded Assemblyversus850 TBL

Applied Materials 0041-26723 Bonded Assembly, EV Group 850 TBL, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
850 TBLEV Group
OEMApplied MaterialsEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyEV Group 850
Specifications
Configuration—Automated bonding system with Laminator[1]
Manufacturer—EV Group[2]
Model—850 TBL[2]
Vintage—2006[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing