Waferpedia

Comparison ledger

0041-26723 Bonded AssemblyversusConnX Elite

Applied Materials 0041-26723 Bonded Assembly, Kulicke & Soffa ConnX Elite, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ConnX EliteKulicke & Soffa
OEMApplied MaterialsKulicke & Soffa
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyKulicke & Soffa Connx
Cited variants—
  • ConnX ELITE Opto LA (Large Area)[1]
  • ConnX ELITE Opto ELA (Extended Large Area)[1]
  • ConnX ELITE Opto LA[2]
  • ConnX ELITE Opto ELA[2]
Specifications
Configuration—50/60 Hz[3]
Bondable area—56 x 80 mm[4]
Placement accuracy—3 µm (3 sigma)[5]
Bonding method—Wire Bonder[5]
Bonding wire length—5 mm[5]
Die pad downset—Up to 2.3 mm[5]
Gold wire size—25.4 µm[5]
Leadframe dimensions—300 x 92 mm[5]
Magazine dimensions—305 x 98 x 178 mm[5]
Minimum loop height—65 µm[5]
Wire pitch—1.27 to 25 mm[5]
Wire sway—25 µm[5]
Air consumption—185 L/min[5]
Air pressure—3.52 kg/sq cm[5]
Power supply—200-240 VAC, -15% to 10%, Single Phase, 50/60 Hz, 2.6 KVA[5]
Net weight—556 kg[5]
Overall dimensions—Base Machine with MHS x 889 x 990 mm[5]
Type—high-speed automatic wire bonder[2]
Category—Packaging & Bonding[2]
Power—50/60 Hz[3]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]zaratech.bizzaratech.biz
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]kns.comkns.com
  5. [5]semiconductor.directorysemiconductor.directory