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Comparison ledger

0041-26723 Bonded Assemblyversus353637 E 90

Applied Materials 0041-26723 Bonded Assembly, West Bond 353637 E 90, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
353637 E 90West Bond
OEMApplied MaterialsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0041-26723 Bonded AssemblyWest Bond 353637 E 90
Specifications
Bonding Area—5.375" × 9.5" (5 3/8" × 9 1/2")[1]
Configuration—2400B Series software[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing