Comparison ledger
Applied Materials 0242-36515 RTP XE Chamber Temperature Match Kit, Vitronics Soltec MyReflow 7038, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0242-36515 RTP XE Chamber Temperature Match KitApplied Materials | Soltec MyReflow 7038Vitronics |
|---|---|---|
| OEM | Applied Materials | Vitronics |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | Vitronics Soltec |
| Specifications | ||
| Configuration | — | 9 + 3 Zones[1] |
| Type | — | Reflow soldering system[2] |
| Transport | — | Pin chain transport[2] |
| Atmosphere | — | Nitrogen[2] |
| Heating zones | — | 10[2] |
| Cooling zones | — | 4[2] |
| Pin length | — | 5 mm[2] |
| Pin distance | — | 19 mm[2] |
| N2 pressure | — | 6 bar[2] |
| PCB width | — | 50 mm - 508 mm[2] |
| Maximum component height | — | 40 mm / 30 mm (top / bottom)[2] |
| Transportation height | — | 832 - 914 mm[2] |
| Width adjustment | — | Electrical[2] |
| Software version | — | 4.0.6.b[2] |
| Construction year | — | 2015[2] |
| Year | — | 2004[3] |
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