Waferpedia

Comparison ledger

Centura I Phase II Oxideversus200 ACU

Applied Materials Centura I Phase II Oxide, Axcelis 200 ACU, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Centura I Phase II OxideApplied Materials
200 ACUAxcelis
OEMApplied MaterialsAxcelis
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials CenturaAxcelis NV GSD 200
Specifications
ConfigurationUpgradable to 8"[1]Parts Machine[3]
Need to replace5-phase motor driver, indexer, turbo pump and controller, e-chuck, MFC's[1]—
Wafer size (original)6 inch[1]—
Wafer size (upgrade target)8 inch (200 mm)[1]—
Wafer size (alternate configuration)200 mm[2]—
Model designation alternative5200 Centura I Phase II[2]—
Manufacturer—Axcelis[3]
Model—200 ACU[3]
Tool type—Asher[3]
Wafer size—200mm[5]
Serial number—AU6A356AH[5]
Computer system—M 200 PC, M 200[6]
Part number—SC 4572 A[6]
Volts—208[6]
Amps—30[6]
Equipment type—Asher[3]
Wafer configuration—8 inch[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]wotol.comwotol.com
  6. [6]semistarcorp.comsemistarcorp.com