Waferpedia

Comparison ledger

Mirra 3400 Wversus100R16

Applied Materials Mirra 3400 W, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Mirra 3400 WApplied Materials
100R16Strasbaugh
OEMApplied MaterialsStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra 3400 WStrasbaugh 100R16
Specifications
Wafer Size8 inch[1]—
Vintage Year1999[1]—
type—1 spindle grinder/polisher[2]
drive system—DC drive system with 2 motors[2]
spindle RPM—1-180 RPM[2]
eccentric RPM—1-90 RPM[2]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[2]
capacity—16 inches[2]
spindle size—1-8 TPI[2]
overall dimensions—28 inches x 36 inches x 48 inches[2]
weight—500 lbs[2]
origin—made in the USA[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]excelltechnology.comexcelltechnology.com