Comparison ledger
Applied Materials P5000, ASM Epsilon 2000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | P5000Applied Materials | Epsilon 2000ASM |
|---|---|---|
| OEM | Applied Materials | ASM |
| Category | Deposition | Deposition |
| Wafer size | 150mm | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials P5000 | ASM Epsilon |
| Specifications | ||
| Process type | Dielectric PECVD[1] | CVD (Chemical Vapor Deposition)[2] |
| Dedicated chambers | Two[1] | — |
| Silicon dioxide chemistry | TEOS/O2[1] | — |
| Silicon nitride chemistry | SiH4/NH3 capable[1] | — |
| Maximum wafer size | 8 inches[1] | — |
| Film thickness | Multiple microns thick[1] | — |
| Nominal operating temperature | ~400C[1] | — |
| Number of chambers | 2[1] | — |
| Chemistry for silicon dioxide | TEOS/O2[1] | — |
| Chemistry for silicon nitride | SiH4/NH3[1] | — |
| Deposited film thickness | Multiple microns[1] | — |
| Operating temperature | ~400°C[1] | — |
| Supply Voltage/ Freq | — | 480/ 50[2] |
| System Hand | — | Right Hand[2] |
| Monitor Type | — | Flat Panel[2] |
| Wafer Size | — | 150mm[2] |
| Maint Console | — | Mini Maint[2] |
| CPU | — | 68040[2] |
| Software Version | — | 7.65[2] |
| Comms | — | HSMS[2] |
| RP/ ATM | — | RP[2] |
| Vacuum Load Locks | — | No[2] |
| WHC Gate Valve | — | Swing[2] |
| WHC Robot Arm | — | Wide[2] |
| Reactor Isolation | — | HVA[2] |
| ATM Valve | — | VAT[2] |
| Pressure Controller | — | MKS 152 Analogue[2] |
| PCV Type | — | MKS 253B[2] |
| Choke Valve | — | Yes[2] |
| RP Orientation | — | Bottom Feed[2] |
| Gas Panel Orientation | — | Top Feed[2] |
| Main H2/N2 | — | 100slm[2] |
| Wafer sizes supported | — | 150 mm and 200 mm wafers[4] |
| Tool type | — | single-wafer epitaxy tool[4] |
| Supply voltage/frequency | — | 480/50[2] |
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