Waferpedia

Comparison ledger

VIISta HE XPversusGSD 200 E 2 High Current

Applied Materials VIISta HE XP, Axcelis GSD 200 E 2 High Current, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Ion Implantation, null[1]
Side-by-side comparison of selected equipment models
Attribute
VIISta HE XPApplied Materials
OEMApplied MaterialsAxcelis
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials VIISTAAxcelis GSD 200
Cited variants—
Specifications
ConfigurationHigh Current[3]Blade Server 120006095C Excluded[2]
ManufacturerApplied Materials / Varian[3]—
ModelVIISta HE XP[3]—
TypeImplanter[3]—
CurrentHigh Current[3]—
Wafer Size8 inch[3]8 inch[2]
Software Version—VM 8.0 (Virtual Machine)[2]
CIM—SECs[2]
Process—B11, BF2, As, P[2]
Handler System—Arm (Non HPES), In Air Handler[2]
Factory Interface—None[2]
Option System—Silicon Disk, SEF EGUN[2]
Process Species—B11, BF2, As, P[2]
Vintage—2001[2]
Disk Drive—Direct-Drive[4]
Dose Type—Regular[4]
Source Type—ELS4 IHC-Source without Vaporizer[4]
Main Workstation—SUN Solaris AXI 3HE (special case)[4]
Second Workstation—SUN Sparc5 on cart with printer[4]
CIM Interface—SECs[2]
High Voltage Transformer—both Oil/Light[4]
Tower Color—red/yellow/green; no buzzer[4]
Network—24-port 100MB Ethernet with Cisco Router[4]
Kit Cell Controller—177[4]
Options—Accel-Highvoltage Probe installed, HPES-Upgrade installed[4]

Plan your fab

Building a Ion Implantation process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]fabsurplus.comfabsurplus.com
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing