Comparison ledger
ASM AD 838 L, Hybond 572 A 40 Thermosonic Wire & Ribbon, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | AD 838 LASM | |
|---|---|---|
| OEM | ASM | Hybond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Wafer Loader | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM AD 838 | Hybond 572 A 40 Thermosonic Wire & Ribbon |
| Cited variants | — | |
| Specifications | ||
| Configuration | 50/60 Hz[1] | Long reach[8] |
| Voltage | 230 Vac[1] | — |
| Phase | 1 Phase[1] | — |
| Power Consumption | 1300 w[4] | — |
| Wafer size | Wafer Loader[5] | — |
| Power | 1300 w[6] | — |
| Frequency | 50/60 Hz[7] | — |
| Wafer Sizes | 6 inch, 8 inch[2] | — |
| Options | — | OP-06B, OP-08A-LED, OP-17, OP-31, WST-15CM, T91S, 9400[8] |
| Ultrasonic system | — | PLL self-tuning, 62.5 KHz (±2.5KHz) nominal[9] |
| Ultrasonic power range | — | 0-1 watt on Low setting (default), 0-2 watts on High setting[9] |
| Bond time range | — | 10 - 400 mSec[9] |
| Bond force range | — | 15 - 120 grams[9] |
| Temperature control range | — | Ambient to 250° C[9] |
| Bondable wire diameters | — | 0.5 to 2.0 mils (12.7 to 50.8 µm)[9] |
| Bondable ribbon dimensions | — | Up to 1 x 10 mils (25.4 x 254 µm)[9] |
| Bondable wire/ribbon materials | — | Gold, aluminum, copper, silver, platinum[9] |
| Bond head movement | — | Manual[9] |
| Bond actuation | — | Switch at fixed height, actuated by lever[9] |
| Z axis travel | — | 0.5 in (12.7 mm) / 60-100 mils (1.52-2.54 mm)[9] |
| X-Y table motion/travel | — | 4:1 manual manipulator standard / 0.9 x 0.9 in (23 x 23 mm) max[9] |
| Input power requirements | — | 110VAC 50/60Hz @ 10A max; 240VAC with OP-12[9] |
| Minimum bench space required | — | Width 25 in, Depth 30 in (63.5 x 76.2 cm)[9] |
| Unit weight | — | 70 lbs (31.8 kg)[10] |
| Shipping weight | — | 150 lbs (68.2 kg)[10] |
| Vacuum requirement | — | 20 inHg minimum[9] |
| Industry standards | — | CE certified[9] |
| Deep vertical access | — | 0.59 in (1.49 cm)[9] |
| Long horizontal reach | — | 6.5 in (16.5 cm)[9] |
| Work platform size (X-Y) | — | 10 x 12 in (25 x 30 cm)[10] |
| Type | — | Thermosonic wedge bonder[11] |
| Bonding capability | — | Wire and ribbon bonding[9] |
| Access type | — | Deep-access, long-reach[11] |
| Soft Touch technology | — | HYBOND Soft Touch bonding technology[9] |
| Wire feed | — | Motorized vertical wire feed[9] |
| Z-axis control | — | Independent Z-axis lever for bonding tool control[9] |
| Stitch capability | — | 1-1-2, 1-2-2, and 1-2-1[9] |
| Spool mounts | — | 0.5 inch and 2 inch spool mounts[9] |
| Work platform | — | 6 x 8.5 inch work platform[11] |
| Wire diameter range | — | 0.5 to 2.0 mils[9] |
| Ribbon dimension | — | Up to 1 x 10 mils[9] |
| Bondable materials | — | Gold, aluminum, copper, silver, platinum[9] |
| Z travel | — | 0.5 in[9] |
| Unit weight / shipping weight | — | 70 lbs / 150 lbs[9] |
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