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AS 899versus1 WBS 1 Wafer Substrate

ASM AS 899, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
AS 899ASM
1 WBS 1 Wafer SubstrateLogitech
OEMASMLogitech
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AS 899Logitech 1 WBS 1 Wafer Substrate
Cited variants
  • AS 899 Die Bonder[1]
  • AS 899 Test & Sort[2]
—
Specifications
CategoryPackaging & Bonding[3]—
Frequency50/60 Hz[2]—
Voltage230 Vac[2]—
Phase1 Phase[2]—
Manufacture year2014[2]—
Wafer Size—6 inch[4]
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Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing