Waferpedia

Comparison ledger

Twinscan XT 1250 Dversus150 e Mask

ASML Twinscan XT 1250 D, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
OEMASMLSUSS MicroTec
CategoryLithographyLithography
Wafer sizeContinuous clampable wafer table for dry WSs: Absent—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML Twinscan XT 1250SUSS MicroTec 150 e Mask
Specifications
Configurationwith Cymer XLA165[1]—
Track Pre-warning signal (APR)sAPR enabled[1]—
Active wafer release for dry WSsFALSE[1]—
Wafer sizeContinuous clampable wafer table for dry WSs: Absent[1]—
Wafer Stage ConfigurationsWafer Stage type 2 configuration[1]—
Wafer Carrier LocationsRight[1]—
Wafers per Carriers25[1]—
Wafer Mark SensorsAbsent[1]—
Wafer Id ReadersAbsent[1]—
Wafer TracksPresent[1]—
Wafer Stage TypesDual Chuck[1]—
Wafer Stress RelaxationsFALSE[1]—
Lower Docking PlatesPresent[1]—
WS Balance MasssStainless Steel[1]—
WH Robot Power AmplifiersCPM 20[1]—
Light sourceCymer XLA165[1]—
Wafer stage typeDual Chuck[1]—
Wafer configurationDry[1]—
Carrier handler typeMark I 300 Foup[1]—
Wafer handling load & unload robot typeDouble Fold Arm, 12 mm Z stroke[1]—
Reticle stage measurement system on scansHeidenhain Encoders[1]—
Reticle stage chuck typeGlued Leafspring, TYPE_2: Glued LS, Pneum. GC, IFM / ENC[1]—
Integrated reticle inspection systemPPD1 with IRIS1 functionality[1]—
Reticle size6 inch[1]—
Wafers per carrier25[1]—
Wafer stage balance massStainless Steel[1]—
Interferometer axis version at exposures3 plus 1 axis[1]—
Universal PrealignmentsDisabled[1]—
Wafer Handling PneumaticssDedicated[1]—

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Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing