Waferpedia

Comparison ledger

Twinscan XT 1400 F ArFversus101

ASML Twinscan XT 1400 F ArF, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
OEMASMLEV Group
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASML Twinscan XT 1400EV Group 101
Specifications
Configuration50/60 Hz[1]—
Phase3 Phase[1]—
Power49 kVA[1]—
Full Load Current79 A/PH[1]—
Largest Load27 A/PH[1]—
Max Interrupt CAp35 kA[1]—
Process Module200 mm[1]—
Conversion Kit300 mm[1]—
OEM—EV Group[2]
Model—101[2]
Equipment name—EVG 101 Spray Coater[2]
NEMO ID—evgspraycoat[2]
Training required—EVG 101 Training[2]
Training duration—1.50 hours[2]
Processing technique—Resist Spray Coat (manual)[2]
Cleanliness—"All"[2]
Location—SNF Paul G Allen L107 Cleanroom[2]
Wafer diameter (substrate size)—up to 300 mm[3]
Available modules—Spin coat / OmniSpray® / develop[3]
Wafer handling options—Bowed / warped / thin wafer handling, edge handling[3]
Dispense options—Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3]
Processing technique (at SNF)—Resist Spray Coat (manual)[4]
Cleanliness group (at SNF)—"All"[2]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]snfguide.stanford.edusnfguide.stanford.edu
  3. [3]evgroup.comevgroup.com
  4. [4]snfguide.stanford.edusnfguide.stanford.edu