Comparison ledger
ASML XT 1250 D, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | XT 1250 DASML | 101EV Group |
|---|---|---|
| OEM | ASML | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASML XT 1250 D | EV Group 101 |
| Specifications | ||
| Configuration | ArF[1] | — |
| Manufacturer | ASML[2] | — |
| Model | XT 1250 D[2] | 101[4] |
| Category | Lithography[1] | — |
| Wafer size | 6 inch[3] | — |
| Light source | Cymer XLA165[3] | — |
| Wafer stage | Dual chuck[3] | — |
| Wafer configuration | Dry[3] | — |
| Carrier handler type | Mark I 300 FOUP[3] | — |
| Reticle stage measurement system | Heidenhain encoders[3] | — |
| OEM | — | EV Group[4] |
| Equipment name | — | EVG 101 Spray Coater[4] |
| NEMO ID | — | evgspraycoat[4] |
| Training required | — | EVG 101 Training[4] |
| Training duration | — | 1.50 hours[4] |
| Processing technique | — | Resist Spray Coat (manual)[4] |
| Cleanliness | — | "All"[4] |
| Location | — | SNF Paul G Allen L107 Cleanroom[4] |
| Wafer diameter (substrate size) | — | up to 300 mm[5] |
| Available modules | — | Spin coat / OmniSpray® / develop[5] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[5] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[5] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[6] |
| Cleanliness group (at SNF) | — | "All"[4] |
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