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Comparison ledger

17099370 Outer strike plateversusGSD 100

Axcelis 17099370 Outer strike plate, Axcelis GSD 100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
GSD 100Axcelis
OEMAxcelisAxcelis
CategoryIon ImplantationIon Implantation
Wafer size—No wafer top-side bar reading
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis 17099370 Outer strike plateAxcelis GSD
Specifications
ConfigurationUsed with Axcelis GSD 200[1]Automated Beam tuning & setup w/Eaton Autotune[3]
ManufacturerAxcelis[2]Axcelis[3]
Model17099370 Outer strike plate[1]GSD 100[3]
Part numberOEM number 17099370[2]—
Used withAxcelis GSD 200[1]—
ConditionNEW[2]—
High Current—GSD 200 E[3]
Date of Audit—August 25, 2025[3]
Loading Configuration—Open Cassette[3]
Software Version—6.12.4[3]
Beamline version—Standard[3]
Energy Range—160 KeV[3]
Single Stage Extraction—80 keV[3]
Post Accel electrode assembly—80 -160 keV[3]
Ion Source Type—ELS[3]
Source Material—Moly[3]
Cryo compressors—CTI 9600[3]
Equipment Type—Implanter[4]
Wafer Size—6 inch[3]
GEM / SECS Interface—Present[3]
Automated Beam Tuning—Automated Beam tuning & setup w/Eaton Autotune[3]
Compatibility—4 cassette compatibility[3]
Automatic Alignment—Automatic flat or notch alignment capability with buffer cassette[3]
Process Disk—NV-GSD 200 Series Process Disk with active cooling & chiller[3]
Beamline Pump—CTI Onboard 10[3]
End Station Cryo Pump—CTI Onboard 8[3]
Source Turbo Pump—STP A 2203 C 2[3]
Gas Connections—Ar, N2[3]
Remote Disk Chiller—SMC HRS 050-WF-20[3]
External Facilities connections—Ar, N2[3]
Wafer size—No wafer top-side bar reading[3]
Source Turbo Pump (P1)—STP A 2203 C 2[3]
Beam Line Cryo Pump (P3)—CTI Onboard 10[3]
End Station Cryo Pump (P2)—CTI Onboard 8[3]
Ar—Tylan FC-2900 MEP, 5 SCCM[3]
Ar MFC—Tylan FC-2900 MEP, 5 SCCM[3]
BF3 Gas—Unit 1660 (SDS), 5 SCCM[3]
AsH3 Gas—Unit 1660 (SDS), 5 SCCM[3]
PH3 Gas—Unit 1660 (SDS), 5 SCCM[3]
Electrical Input—3-phase, 208 V[4]
Power Consumption—50 kVA[4]
Beam Current—15 mA[4]
Output Rating—160 kV[4]
Flag Faraday Injector—Present[3]
Signal Tower—Present[3]
Direct Drive—Yes[3]
Electron Shower—Yes[5]
Cell V6 Control—Yes[5]
Solaris—Yes[5]
SDS Gas Box—Yes[5]
Cassette Compatibility—4 cassette compatibility[3]
Automatic Flat/Notch Alignment—Yes, with buffer cassette[3]
Standard Manuals Included—Yes[3]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]waferpedia.comwaferpedia.com