Waferpedia

Comparison ledger

Fusion M 200 PCU UVversus1000 Hot Plate

Axcelis Fusion M 200 PCU UV, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMAxcelisCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAxcelis Fusion M 200 PCU UVCEE 1000 Hot Plate
Specifications
MakeAxcelis[1]—
ModelFusion M 200 PCU[1]—
Wafer Sizes8 inch[1]—
System TypeUV Cure System[1]—
Configuration—4"[2]
Type—Hot Plate[2]
Wafer Size—4 inch[2]

Plan your fab

Building a Thermal / Diffusion process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]inventory listing