Comparison ledger
Besi 2200 APM Die Attach Flip Chip, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | |
|---|---|---|
| OEM | Besi | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Vacuum plate[1] | — |
| Manufacturer | Besi / Datacon[1] | — |
| Model | 2200 APM[1] | — |
| Machine type | Die attach / flip chip machine[2] | — |
| Vacuum & pumping | Vacuum plate[2] | — |
| Wafer handling | 12" wafer handling[3] | — |
| Integrated dispenser | Integrated dispenser[3] | — |
| Tooling | Automatic tool changer[3] | — |
| Wafer Size | — | 6 inch[4] |
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