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Comparison ledger

18 D SurfaceversusMWS-SiC12F

Blanchard 18 D Surface, Takatori MWS-SiC12F, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
MWS-SiC12FTakatori
OEMBlanchardTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceTakatori MWS-SiC12F
Cited variants—
Specifications
Voltage416 V[2]—
Phase3 Phase[2]—
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[2]—
Power416 V, 3 phase[2]—
Product line—MWS (Multi Wire Saw)[1]
Machine type—multi wire saw[1]
Capable materials—SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold and other hard brittle material[1]
Variable processing conditions—thin wire, high wire tension, fast wire running, extra-long time slicing process[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]takatori-g.co.jptakatori-g.co.jp
  2. [2]inventory listing
  3. [3]Equipment inventory listing